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Quick Details

  • Adhesive Side: Double Sided
  • Adhesive: Acrylic
  • Adhesive Type: Pressure Sensitive
  • Feature: Heat-Resistant
  • Place of Origin: Guangdong, China (Mainland)
  • Brand Name: Leader OPUS
  • Model Number: LD8N12
  • Product Name: Thermal Tape in insulation Materials&Elements
  • Thermal Conductivity: 1.2w/m.k
  • Adheisve: Pressure sensitive adhesive
  • Breakdown Voltage: >2KV
  • Thickness: 0.1-0.5mm
  • Die-cut Parts: Available
  • Continuous Use Temp.: -20--120℃
  • RoHS,Reach Compliance: Yes

Packaging & Delivery

Packaging Details up to sizes of die-cut parts
Delivery Time 3-5days

        Thermal Tape in insulation Materials&Elements  

 

Features & Benefits: 

² Higbonstrengtta variety of low energy surfaces           

² Easy Application

² Eliminates need for screws,clips,etc.

²    Available with easy release tabs  

 

Configurations:

² Roll form,sheet form

² Die-cut parts with tabs

 

Available sizes:

² Thickness: 0.1,0.15,0.2,0.25,0.3,0.4,0.5mm

² Width:1030mm

²  Length:50m

²  Custom size:please contact local sales of Leader for information and availability of die-cut parts.

 

 

Properties

8N12-T10

8N12-T15

8N12-T20

Carrier

NONE

NONE

NONE

Thickness

0.10mm

0.15mm

0.20mm

Adhesion 

Peel Strength(PSTC-101)(N/25mm)

>13.72

>13.72

>15.68

Temp Resistance(S)°C (°F)

180(356)

180(356)

180(356)

Temp Resistance(L)°C(°F)

120(248)

120(248)

120(248)

Continues Use. Temp.(°C)

-20 to 120

-20 to 120

-20 to 120

Retention(1Kg/Inch/25°C)

>48

>48

>48

Adhesion(Kg/Inch)

1.4

1.4

1.4

Initial Adhesion(J.DOW)

12

14

16

Electrical 

Breakdown Voltage(KV)

2.22

2.55

4.29

Thermal

Thermal conductivity (ASTM D5470)

1.2w/m.k

1.2w/m.k

1.2w/m.k

Thermal Resistance(AMD240)@40PSI    

0.558C*in2/w

1.07C*in2/w

1.173C*in2/w

 

 Remark:

a. Data for design engineer spec. reference only. Engineers are reminded to test the material in application.

b. Shelf life: 15 months from date of manufacture when stored at storage temperature 23±5  ° C ,relative humidity is 60% in the products original packaging.

 

Typical Application Includes:

 

² LED Lightings

² Between heat sinks/spreaders and chips

² DDR RAM assembly

 

 

 


  

 

 

 

 

 

 

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